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Symposium N
Materials, Structures & Devices for Nanoscale Electronic-Photonic Integration

Chairs

  • Ping BAI, Institute of High Performance Computing, Singapore
  • Patrick LO, Institute of Microelectronics, Agency For Science Technology & Research (A*STAR), Singapore

Co-Chairs

  • Erping LI, Institute of High Performance Computing, Singapore
  • Anatoly ZAYATS, King's College London, United Kingdom
  • Peter NORDLANDER, Rice University, United States

Correspondence

  • Dr Ping Bai, Institute of High Performance Computing, Singapore
    Email: baiping@ihpc.a-star.edu.sg
    Tel: +65 6419 1242
    Fax: +65 6463 5176
    Mailing Address:
    Electronics & Photonics Department
    Institute of High Performance Computing
    1 Fusionopolis Way, #16-16 Connexis

    Singapore 138632

Scope of Symposium

The integration of optical devices into electronic circuits can achieve both the advantages of ultra-compactness in electronics and super-wide bandwidth in optics. However, the dimensions of traditional optical devices are fundamentally limited by the law of diffraction and consequently limit the progress of merging photonic circuits with electronics. Plasmonics emerges as a promising technology platform towards deployment of small-footprint integrated-circuitry for chip-scale and high density integration. Meanwhile, vertically binding photonic devices with semiconductor electronic circuits allow utilization of III-V materials which are more favorable to photonic devices. An unprecedented synergy could be reached through full exploitation of the advantages of photonic, plasmonic and nanoelectronic device technologies by integrating them into the same platform. The goal of this Symposium is to collect the latest achievements in the field of plasmonics and photonics for on-chip optoelectronic integration, bringing together all relevant concepts, modeling and simulation, fabrication techniques, characterization technologies, components, devices and systems that could in-principle be utilized in the areas of on-chip data transmission. Therefore, this Symposium welcomes, but does not limit, contributed submissions on the following list of research topics:
• Passive and active nanophotonic and plasmonic devices (i.e. waveguides, couplers, filters, multiplexers, modulators, photodetectors, amplifiers and lasers)
• CMOS-compatible plasmonics and silicon plasmonics
• III-V material based photonic devices
• Hybrid devices and binding III-V device to Si wafer
• Integrated plasmonic/photonic circuits
• Plasmonic materials, nanoparticles, nanoantennas and resonant cavities
• Functional materials (i.e. gain, thermo-optical, electro-optical, optical-optical and transparent conductor)
• Functional properties (i.e. absorption, gain, emitting, and resonance induced charge transfer )

Proceedings

The manuscripts of all those papers that are presented at the conference and accepted after peer review will be published online in “Procedia Engineering” by  Elsevier. Details for online submission of the manuscripts will be made available by concerned symposium chair while accepting the paper for presentation at the conference.

Invited Speakers

  • Hong Son CHU, Institute of High Performance Conputing, Singapore ( Abstract )
  • Tao CHU, Chinese Academy of Sciences, China ( Abstract )
  • Michael HOCHBERG, University of Delaware, United States ( Abstract )
  • Nikos PLEROS, Center for Research and Technology Hellas, Greece ( Abstract )
  • Dawn TAN, Singapore University of Technology and Design, Singapore ( Abstract )
  • Din Ping TSAI, National Taiwan University, Taiwan ( Abstract )
  • Vien VAN, University of Alberta, Canada ( Abstract )
  • Laurent VIVIEN, University Paris-Sud, France ( Abstract )
  • QiJie WANG, Nanyang Technological University , Singapore ( Abstract )
  • Shumin XIAO, Harbin Institute of Technology, China ( Abstract )
  • Gang ZHANG, Institute of High Performance Computing, Singapore ( Abstract )

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