Industry Workshop on Microelectronic Process and Package Characterization and Reliability Analysis
Gopal KRISHNAN, National University of Singapore, Singapore
Sanjay Kumar THAKUR, Rolls-Royce, Singapore
Rong LIU, National University of Singapore, Singapore
Gopal KRISHNAN, National University of Singapore, Singapore Email: firstname.lastname@example.org Tel: +65 6516 3507 Fax: +65 6777 6126 Mailing Address: Physics Department, Blk S12 Faculty of Science National University of Singapore 2 Science Drive 3 Singapore 117542
Scope of Symposium
Information and communication technology(ICT)-based personal assistant such as smartphone and iPad have provided rapid and reliable access to ideas and experiences from a wide range of people, communities and cultures, and allows everyone at every level to collaborate and exchange information on a wide scale. The Si based semiconductor ecosystem development in micro and nanolandscape continues to be the key and indispensable enabler and a formidable force in ICT evolution.
Analytical support has played and still plays a predominant role in material & process research, process development, defect free manufacturing and reliability. Advanced analytical tools and specialized methodologies have been providing facility to leading edge research labs and global manufacturers to link composition , structure, morphology, roughness, hardness and adherence with defect reduction, yield improvement and optimum performance enhancement. The principle and application of electron, photon, ion beam-based analytical tools such as XPS, AES, SIMS, AFM, TEM/EDX/EELS, FIB/SEM ,X-ray imaging, XRD, XRF, RBS, PIXE, FT-IR, GC-MS, AAS, ICP-OES, are briefly described with references to will be presented with specific references to microelectronic process and package industry cluster.
This comprehensive one day workshop enables the attendees to understand and appreciate the fundamentals of electronic materials science, process development, various coating technologies, equipment options, testing, reliability, front end/back-end manufacturing coupled with analysis on cost, market, materials availability, yield issues, trends, drivers and roadmap of challenging microelectronic ecosystem.
Co-organized with Singapore Surface Engineering Association
Raphael BAILLOT, IMS Laboratory,
Ryan BANAL, Kyoto University,
Robert BOYD, National Physical Laboratory,
Arthur CHIANG, Vishay Siliconix,
Akira HASEGAWA, Oki Engineering Co., Ltd.,
JaeSeong JEONG, Korea Electronics Technology Institute,